Quectel Unveils SE200ZC-AP Smart Module with Advanced Camera Support

Introduction to the SE200ZC-AP Module

Quectel has introduced the SE200ZC-AP, a compact smart module measuring 40 x 40 mm, designed to leverage the power of the Rockchip RV1126B/RV1126BJ quad-core Arm Cortex-A53 SoC. This module is equipped with impressive features, including a 12MP image signal processor (ISP) and an 8MP AI-ISP, alongside a neural processing unit (NPU) capable of 3 TOPS.

Camera and Interface Capabilities

The SE200ZC-AP module supports an extensive range of camera configurations, allowing for the connection of up to five 12MP cameras through dual 4-lane MIPI CSI interfaces and a DVP interface. Additionally, it boasts a variety of interfaces, including Gigabit Ethernet, USB 3.0/2.0, and multiple UART, I2C, SPI, and GPIO options, ensuring versatile connectivity for various applications.

Applications and Specifications

With options for 1GB, 2GB, or 4GB LPDDR4x memory and 64GB eMMC flash storage, the module is available in both commercial and industrial grades, supporting operating temperatures ranging from -25°C to +75°C and -35°C to +80°C, respectively. These specifications make the SE200ZC-AP particularly suitable for smart security systems, industrial automation, autonomous vehicles, robotic vision, and smart home technologies.

Source: CNX Software – Embedded Systems News (https://www.cnx-software.com/2026/09/24/quectel-se200zc-ap-smart-module-supports-up-to-five-cameras-with-rockchip-rv1126b-bj-soc/)